About the Conference
Excellence in Electronics
The IEEE Electronics Packaging Society (EPS) presents this premier international conference, bringing together the brightest minds in electronics packaging technology from around the globe.
Global Networking
Connect with researchers, practitioners, and industry leaders. Share insights, discover innovations, and build partnerships that will shape the future of electronics packaging.
Important Dates
Mark your calendars for these crucial milestones
Call for Papers Closed
July 15, 2025
Submission Portal Opens
July 15, 2025
Submission Deadline
December 15, 2025
Author Notifications
January 12, 2026
Camera Ready Due
February 07, 2026
Conference Dates
March 2-3, 2026
Conference Tracks
Electronics, Packaging, Design & Manufacturing: Bridging Skills & Innovation for India's Industry
Semiconductors, VLSI & Advanced Packaging
- • Heterogeneous Integration and SiP
- • Fan-Out Wafer-Level Packaging
- • 3D IC and Through-Silicon Vias
- • Advanced Substrates and Interposers
Embedded Systems & Power Electronics
- • Power Electronics & Thermal Management
- • Wide Bandgap Semiconductors (SiC, GaN)
- • Embedded System Design & Applications
- • High-Frequency & RF Applications
IoT & Smart Systems
- • IoT Architectures & Protocols
- • Smart Cities & Infrastructure
- • Wearable & Connected Devices
- • Edge Computing & Sensor Networks
Artificial Intelligence, Machine Learning & Digital Twins
- • AI-Driven Design & Optimization
- • Machine Learning for Predictive Analysis
- • Digital Twins for Design & Testing
- • Automation & Robotics in Manufacturing
Intelligent Communication, Energy & Sustainable Systems (ICESS)
- • Intelligent Communication Networks
- • Renewable Energy & Smart Grids
- • Sustainable & Green Electronics
- • Energy Harvesting & Storage Systems
Security & Blockchain Technologies
- • Cybersecurity for Electronics & IoT
- • Blockchain for Supply Chain & Authentication
- • Hardware Security & Trusted Computing
- • Privacy-Preserving Technologies
Our Sponsors
We are grateful to our sponsors for their generous support
Supporting Brands
Industry leaders supporting the advancement of electronics packaging
International Association Partners
Collaborating with leading global electronics and technology associations
Media Partner
Our official media partner for conference coverage
Industry Collaboration
Partnering with leading global technology companies to bridge academia and industry
Knowledge Partners
Collaborating with renowned organizations to enhance learning and research opportunities
Contact Information
Get in touch with our organizing committee
Conference Chair
General Inquiries
Prof. (Dr.) Ashwini Kumar Aggarwal
Professor of Practice, MRIIRS
Founder & Chair, IEEE EPS NCR Chapter
Conference Co-Chair
Primary Contact
Dr. Umesh Dutta
CEO MRIIF & Associate Professor
Department of ECE
Venue Location
Conference Venue